Symposium FA
Materials Issues in Flexible and Stretchable Electronics
Co-Chairs:
Mario CAIRONI, Istituto Italiano di Tecnologia, Italy (Convener)
Ingrid GRAZ, Johannes-Kepler University Linz, Austria
Members:
Aram AMASSIAN, King Abdullah University, Saudi Arabia
Zhenan BAO, Stanford University, USA
Reinhard R. BAUMANN, TU Chemnitz, Germany
Mariano CAMPOY-QUILES, ICMAB-CSIC, Spain
Tricia Breen CARMICHAEL, University of Windsor, Canada
Martin HEENEY, Imperial College London, UK
Yonggang HUANG, Northwestern University, USA
Olle INGANAS, Linkoping University, Sweden
Martin KALTERBRUNNER, Johannes-Kepler University Linz, Austria
Dae-Hyeong KIM, Seoul National University, South Korea
Stephanie LACOUR, EPFL, Switzerland
Pooi See LEE, Nanyang Technological University, Singapore
George G. MALLIARAS, University of Cambridge, UK
Virgilio MATTOLI, Istituto Italiano di Tecnologia, Italy
Ivan MINEV, Technical University Dresden, Germany
Christian MUELLER, Chalmers University of Technology, Sweden
John A. ROGERS, University of Illinois, USA
Tsuyoshi SEKITANI, Osaka University, Japan
Herbert SHEA, EPFL, Switzerland
Takao SOMEYA, University of Tokyo, Japan
Bob STREET, PARC, USA
Shizuo TOKITO, Yamagata University, Japan
Luisa TORSI, University of Bari, Italy
Jan VANFLETEREN, Ghent University – IMEC, Belgium
Sigurd WAGNER, Princeton University, USA
Matthew WHITE, University of Vermont, USA
Mario CAIRONI, Istituto Italiano di Tecnologia, Italy (Convener)
Ingrid GRAZ, Johannes-Kepler University Linz, Austria
Members:
Aram AMASSIAN, King Abdullah University, Saudi Arabia
Zhenan BAO, Stanford University, USA
Reinhard R. BAUMANN, TU Chemnitz, Germany
Mariano CAMPOY-QUILES, ICMAB-CSIC, Spain
Tricia Breen CARMICHAEL, University of Windsor, Canada
Martin HEENEY, Imperial College London, UK
Yonggang HUANG, Northwestern University, USA
Olle INGANAS, Linkoping University, Sweden
Martin KALTERBRUNNER, Johannes-Kepler University Linz, Austria
Dae-Hyeong KIM, Seoul National University, South Korea
Stephanie LACOUR, EPFL, Switzerland
Pooi See LEE, Nanyang Technological University, Singapore
George G. MALLIARAS, University of Cambridge, UK
Virgilio MATTOLI, Istituto Italiano di Tecnologia, Italy
Ivan MINEV, Technical University Dresden, Germany
Christian MUELLER, Chalmers University of Technology, Sweden
John A. ROGERS, University of Illinois, USA
Tsuyoshi SEKITANI, Osaka University, Japan
Herbert SHEA, EPFL, Switzerland
Takao SOMEYA, University of Tokyo, Japan
Bob STREET, PARC, USA
Shizuo TOKITO, Yamagata University, Japan
Luisa TORSI, University of Bari, Italy
Jan VANFLETEREN, Ghent University – IMEC, Belgium
Sigurd WAGNER, Princeton University, USA
Matthew WHITE, University of Vermont, USA
Iain ANDERSON, University of Auckland, New Zealand
Ana ARIAS, University of California, Berkeley, USA
Craig ARMIENTO, Umass Lowell, USA
Beatrice FRABONI, University of Bologna,,Italy
Francesco GRECO, Graz University of Technology, Austria
Rylie GREEN, Imperial College London, UK
Martin KALTENBRUNNER, Johannes-Kepler University Linz, Austria
Martijn KEMERINK, Linkoping University, Sweden
Dae-Hyeong KIM/Jahoon KOO, Seoul National University, South Korea
Taek-Soo KIM, KAIST, South Korea
Stephanie LACOUR / Giuseppe SCHIAVONE, EPFL, Switzerland
Darren J. LIPOMI, University of California, San Diego, USA
Yong-Young NOH, Dongguk University, South Korea
Jonathan REEDER, Northwestern University, USA
Natalie STINGELIN, Georgia Tech & Imperial College London, USA & UK
Klas TYBRANDT, Linkoping University, Sweden
Ana ARIAS, University of California, Berkeley, USA
Craig ARMIENTO, Umass Lowell, USA
Beatrice FRABONI, University of Bologna,,Italy
Francesco GRECO, Graz University of Technology, Austria
Rylie GREEN, Imperial College London, UK
Martin KALTENBRUNNER, Johannes-Kepler University Linz, Austria
Martijn KEMERINK, Linkoping University, Sweden
Dae-Hyeong KIM/Jahoon KOO, Seoul National University, South Korea
Taek-Soo KIM, KAIST, South Korea
Stephanie LACOUR / Giuseppe SCHIAVONE, EPFL, Switzerland
Darren J. LIPOMI, University of California, San Diego, USA
Yong-Young NOH, Dongguk University, South Korea
Jonathan REEDER, Northwestern University, USA
Natalie STINGELIN, Georgia Tech & Imperial College London, USA & UK
Klas TYBRANDT, Linkoping University, Sweden
Flexible and stretchable electronics is empowering unprecedented approaches to ubiquitous electronics: owing to its mechanical compliance, it offers opportunities for many new applications in energy transformation and storage, deformable displays, wearable electronic systems, memory devices, compliant large area electronics and in bioelectronics.
Major challenges for research is to achieve both excellent long-term reliable mechanical soundness and electronic performance, joined with compatibility with living tissues and low-toxicity when biomedical applications are involved. The intrinsic mechanical properties of molecular and polymeric organic semiconductors in principle render them ideal candidates for a range of flexible and conformable devices. Nevertheless, when very high performing active electronic components are required, inorganic materials and novel nanomaterials may be the preferred options, demanding alternative device architectures to accommodate for the respective mechanical properties.
This symposium aims at presenting timely research in materials, their mechanics, designs, modelling, novel phenomena and techniques enabling the fabrication of flexible, stretchable and ultra-conformable electronics for the diverse fields of ongoing or potential applications, with special focus on demand on materials and prospective solutions.
Major challenges for research is to achieve both excellent long-term reliable mechanical soundness and electronic performance, joined with compatibility with living tissues and low-toxicity when biomedical applications are involved. The intrinsic mechanical properties of molecular and polymeric organic semiconductors in principle render them ideal candidates for a range of flexible and conformable devices. Nevertheless, when very high performing active electronic components are required, inorganic materials and novel nanomaterials may be the preferred options, demanding alternative device architectures to accommodate for the respective mechanical properties.
This symposium aims at presenting timely research in materials, their mechanics, designs, modelling, novel phenomena and techniques enabling the fabrication of flexible, stretchable and ultra-conformable electronics for the diverse fields of ongoing or potential applications, with special focus on demand on materials and prospective solutions.
Session Topics
FA-1 Materials and fabrication processes
- Emerging Organic, Inorganic and Hybrid active device materials (conductors, semiconductors, dielectrics)
- Functional electronic inks for flexible and stretchable electronics
- Advanced growing, printing and patterning technologies for flexible and stretchable electronics
- Nonplanar fabrication processes
- Substrates and encapsulating/barrier materials and methods
FA-2 Device physics, mechanics and design
- Charge injection, transport and generation phenomena in materials for flexible/stretchable electronics
- Design of highly stretchable/deformable and conformable electronics
- Mechanics of thin film deposited on (or embedded in) plastic substrates
- Biomechanics of soft biological tissue/device interfaces
- Mechanical, thermal and electronic modelling of flexible/stretchable hybrid electronic systems and components
FA-3 Applications of flexible/stretchable electronics
- Electronics and optoelectronics: flexible/stretchable thin film transistors, bendable/stretchable/conformable electronic circuits, sensors, light emitting diodes
- Flexible energy conversion/storage: solar cells, thermoelectric generators, fuel cells, batteries, supercapacitors, energy harvesters
- Biomedical: conformable neural interfaces, implantable soft devices, bioMEMS, prosthetic skin
- Transducers: e-textiles, wearable electronics, cyber-skin, flexible MEMS, microsensors, microactuators, etc
- Bio-inspired systems in organic electronics for biotechnology and medical applications