Symposium FI
Materials and Technologies for Next Generation Solid State Lighting

Chairs:
Shuji NAKAMURA, University of California, USA  (Honorary Chair)
Michele MUCCINI, CNR-ISMN, Italy  (Convener)
 
Members:
Martin ALBRECHT, Leibniz Institute for Crystal Growth, Germany
Franco CACIALLI, University College London, UK
Shyan-Lung CHUNG, National Cheng Kung University, Taiwan
Martin DAWSON, University of Strathclyde, UK
Jorge M. FERREIRA MORGADO, IT - Lisboa,Portugal
Steve FORREST, University of Michigan, USA
Chennupati JAGADISH, Australian National University, Australia
Jwo-Huei JOU, National Tsing Hua University, Taiwan
Hani KANAAN, CEA, France
Bernard KIPPELEN, Georgia Inst.of Technology, USA
Xiangyang MA, Zhejiang University, China
Christian MAY, Fraunhofer FEP, Germany
Andy MONKMAN, Durham University, UK
Ivan MORENO, Universidad Autonoma de Zacatecas, Mexico
Yasushi NANISHI, Ritsumeikan University, Japan
Jongwook PARK, Kyung Hee University, South Korea
Matthew PHILLIPS, University of Technology, Sidney, Australia
Sebastian REINEKE, University of Dresden, Germany
David J. ROGERS, Nanovation SARL, France
Ullrich SCHERF, University of Wuppertal, Germany
Xiao Wei SUN, Southern University of Science and Technology, China
Stefano TOFFANIN, CNR-ISMN, Italy
Sridharan VENK, OSRAM S.p.A. , Italy
Ken-Tsung WONG, National Taiwan University, Taiwan
Chung-Chih WU, National Taiwan University, Taiwan
Rong-Jun XIE, NIMS, Japan
 
There is a stringent demand world-wide for the development and adoption of highly efficient solid state lighting technologies to achieve radical energy savings. LED is now a technology that is finding its path towards the general lighting market, both indoor and outdoor. Significant advances in the understanding of materials, devices and systems are driving the development of novel light sources and light integration concepts.
Despite performances of organic LEDs (OLEDs) are still lower and costs still higher than LED lighting technologies, OLED lighting devices start to benefit from their strong advantages (large surface, lightness, thinness, ability to be color-tunable, flexible and transparent, recyclability). To fully develop its potential and capitalize on its highly desirable figures of merit, OLED technology must address a number of technical, scientific and technological issues related to materials, manufacturing processes, device architecture and system integration. These issues specifically include the development and use of performing phosphorescent emitters and transport materials compatible with dry and wet processes, the development of low cost methods to prepare the substrate – rigid or flexible - with the needed interconnections, the deposition and patterning of the electrodes and the organic stack, the inclusion of photonic structures to tailor the optical properties.
The purpose of this Symposium is to provide a highly cross-disciplinary forum for scientists, engineers and industry experts for ground-breaking cross-fertilization between the different area of expertise in the field of solid state lighting. The symposium will highlight recent advances in the synthesis of novel materials, thin films and nanostructures; characterization of layers and interface properties on the nano- and micro-scale; novel optoelectronic device architectures such as planar and vertical OLETs (organic light-emitting transistors); advanced manufacturing of materials and devices; and innovative photonic structures for tailored light out-coupling.
 
Topics of interest include (but are not limited to):
  • Design and synthesis of novel LED materials
  • Design and synthesis of molecular materials, nanostructures and thin-film
  • Nanofabrication and assembly techniques for photonic structures
  • Advanced optoelectronic device architectures – OLED and OLET
  • Optical and electronic properties
  • Charge injection and transport
  • Modeling of optoelectronic properties of materials 
  • Device physics and modeling
  • Thin films, heterostructures, interfaces
  • Structure-properties relationship
  • Dry, wet and hybrid processing and manufacturing
  • Device and system integration
Session Topics

FI-1 Material design and processing

FI-2 Optoelectronic and photonic processes

FI-3 Electro-optical-structural characterization

FI-4 Device architectures and system integration

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Cimtec 2018

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